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Thread ID: 78970	2007-05-04 02:34:00	Moore's Law Extended Again....	SurferJoe46 (51)	PC World Chat

Post ID	Timestamp	Content	User
546818	2007-05-04 02:34:00	Funny...just when you thought it was surely dying...Big Blue figgers out a new way: :nerd: The elves at IBM have once again come up with a chip-making technique that promises to forestall the oft-predicted end for Moore's Law. The "airgap" technology, announced today, produces chips with much improved circuit insulation via a process that mimics the way snowflakes are formed. As chips have gotten smaller and denser, the challenge of preventing internal power leakage and the resulting heat has gotten larger. For years, chip makers have used materials like silicon dioxide to insulate the microscopic wiring. But even better insulation can be achieved by creating a vacuum around the wires. The IBM engineers came up with a polymer-based material that assembles itself into a pattern of evenly spaced, 20-nanometer dots that can then be etched away, leaving trillions of tiny holes that are then capped to form a vacuum. "People have been trying to figure out how to do this for years and IBM did it," said Nathan Brookwood, research fellow at Insight 64. Bottom line: Over the next few years, the process will produce chips that are substantially faster, cooler and smaller, probably in IBM servers first, and then who knows where.	SurferJoe46 (51)
546819	2007-05-04 05:56:00	Funny...just when you thought it was surely dying...Big Blue figgers out a new way: :nerd: The elves at IBM have once again come up with a chip-making technique that promises to forestall the oft-predicted end for Moore's Law. The "airgap" technology, announced today, produces chips with much improved circuit insulation via a process that mimics the way snowflakes are formed. As chips have gotten smaller and denser, the challenge of preventing internal power leakage and the resulting heat has gotten larger. For years, chip makers have used materials like silicon dioxide to insulate the microscopic wiring. But even better insulation can be achieved by creating a vacuum around the wires. The IBM engineers came up with a polymer-based material that assembles itself into a pattern of evenly spaced, 20-nanometer dots that can then be etched away, leaving trillions of tiny holes that are then capped to form a vacuum. "People have been trying to figure out how to do this for years and IBM did it," said Nathan Brookwood, research fellow at Insight 64. Bottom line: Over the next few years, the process will produce chips that are substantially faster, cooler and smaller, probably in IBM servers first, and then who knows where.Once again proving that less is more!! And probably making a buck or two at the same time...	johcar (6283)
546820	2007-05-04 05:57:00	Waste of time, Doesn't everyone already know that Sony have produced the first real Supercomputer, and then used it in a game console. Lmao. Come on people, Swallow your propaganda like good sheep.	Metla (12)
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